Restoring a defective hi-rel microelectronic circuit to its original specifications - in function and physical condition - is termed "Rework". This can be difficult, because packaged microelectronics are complex and subject to many manufacturing restrictions. In many cases, they are not designed to be reworked.
Rework is NOT the same as repair, which restores function but may change physical specifications. So why not just repair defective parts?
Because it is not allowed. Many high reliability applications prohibit repaired parts, because it is not possible to confirm they will meet performance and durability limits. Genuine "rework" promises parts that are good as new.
This is where Midas Technology comes in. Our machines allow manufacturers to accomplish two tasks that are critical to successful rework:
- Remove Lids from hermetic packages - without debris, vibration damage, or dimensional change - so they can be reworked and resealed to their original specifications,
- Remove Die and components from inside the package so they can be replaced - without overheating or damaging adjacent devices.