In contrast, "repair" processes may fix the defect, but leave the product altered in dimension or performance characteristics. A hermetic package which has its lid removed by a milling machine, for example, may or may not reseal successfully, but it will certainly lose some package height as a result of being milled. Even if it seals, the repaired package is not the same as the original, and it may have been exposed to undesirable contamination and other damage.

In the mid 1980’s many production engineers felt that successful "rework" with existing machines was not possible, and focused their attention instead on controlling yield losses through quality and process improvements. While this worked for low-value, high volume production (e.g. automotive applications) it didn’t solve the problems engineers had building complex hi-reliability (Hi-Rel) parts with many thousands of potential failure points. This is where we came in.

Midas Technology was founded in 1986, after a rework survey of hybrid microelectronics manufacturers suggested the need for two key technologies. The first was non-destructively removing lids from sealed packages, so they could be fixed and resealed in original condition. (LINK TO TECHNOLOGY OF LID REMOVAL) Second was removing components from densely populated circuits without overheating or physically damaging adjacent devices. (LINK TO TECHNOLOGY: COMPONENT REMOVAL) From the very beginning, our machines were developed in close consultation with prospective users, and designed to meet or exceed US military standards for rework processes.

With the advent of the 21st century, our equipment is in its fifth generation, and it incorporates the suggestions of thousands of engineers and operators. Our machines have dramatically changed industry attitudes towards rework and we look forward to continuing our close partnership with circuit manufacturers for many years to come.